What is Cu clip package? metal

Power chips are connected to external circuits through product packaging, and their performance depends on the assistance of the product packaging. In high-power scenarios, power chips are usually packaged as power components. Chip affiliation describes the electric connection on the top surface of the chip, which is usually aluminum bonding wire in standard components. ^
Conventional power module bundle cross-section

Currently, industrial silicon carbide power components still mainly use the product packaging technology of this wire-bonded conventional silicon IGBT module. They encounter problems such as large high-frequency parasitic parameters, insufficient warm dissipation capability, low-temperature resistance, and not enough insulation toughness, which limit using silicon carbide semiconductors. The screen of outstanding efficiency. In order to address these issues and completely exploit the significant possible advantages of silicon carbide chips, many new packaging innovations and options for silicon carbide power components have emerged in recent years.

Silicon carbide power component bonding technique

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have established from gold wire bonding in 2001 to aluminum cable (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually developed from gold cords to copper wires, and the driving force is cost decrease; high-power tools have actually established from aluminum wires (strips) to Cu Clips, and the driving pressure is to enhance item efficiency. The higher the power, the higher the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that uses a strong copper bridge soldered to solder to connect chips and pins. Compared to typical bonding product packaging methods, Cu Clip technology has the adhering to advantages:

1. The link in between the chip and the pins is constructed from copper sheets, which, to a certain level, changes the common cord bonding approach in between the chip and the pins. For that reason, a distinct plan resistance worth, greater existing circulation, and much better thermal conductivity can be acquired.

2. The lead pin welding location does not require to be silver-plated, which can fully conserve the expense of silver plating and inadequate silver plating.

3. The product appearance is entirely constant with typical products and is primarily made use of in web servers, portable computer systems, batteries/drives, graphics cards, motors, power products, and various other areas.

Cu Clip has 2 bonding techniques.

All copper sheet bonding approach

Both the Gate pad and the Source pad are clip-based. This bonding technique is extra pricey and complex, but it can attain far better Rdson and far better thermal impacts.

( copper strip)

Copper sheet plus cord bonding technique

The resource pad utilizes a Clip method, and the Gate uses a Cord approach. This bonding approach is a little less costly than the all-copper bonding method, saving wafer location (appropriate to really small gate locations). The process is less complex than the all-copper bonding approach and can acquire far better Rdson and much better thermal effect.

Distributor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding metal, please feel free to contact us and send an inquiry.

Inquiry us